Micron Technology MT38W2011AA033JZZI-X68

表面安装

YES

终端数量

52

Package Description

TFBGA,

Package Style

GRID ARRAY, THIN PROFILE, FINE PITCH

Number of Words Code

4000000

Package Body Material

PLASTIC/EPOXY

Operating Temperature-Min

-40 °C

Operating Temperature-Max

85 °C

Manufacturer Part Number

MT38W2011AA033JZZI.X68

Number of Words

4194304 words

Supply Voltage-Nom (Vsup)

1.8 V

Package Code

TFBGA

Package Shape

RECTANGULAR

Manufacturer

Micron Technology Inc

Part Life Cycle Code

Obsolete

Ihs Manufacturer

MICRON TECHNOLOGY INC

Risk Rank

5.81

附加功能

IT ALSO CONTAINS 16MBIT(1MBIT X 16) PSRAM

HTS代码

8542.32.00.71

技术

CMOS

端子位置

BOTTOM

终端形式

BALL

功能数量

1

端子间距

0.5 mm

Reach合规守则

unknown

JESD-30代码

R-PBGA-B52

电源电压-最大值(Vsup)

1.95 V

温度等级

INDUSTRIAL

电源电压-最小值(Vsup)

1.7 V

操作模式

SYNCHRONOUS

组织结构

4MX16

座位高度-最大

1.2 mm

内存宽度

16

记忆密度

67108864 bit

内存IC类型

存储器电路

宽度

4 mm

长度

6 mm