Micron Technology MT45W8MW16BGX-708WT ES

表面安装

YES

终端数量

54

Package Description

FBGA, BGA54,6X9,30

Package Style

GRID ARRAY, FINE PITCH

Number of Words Code

8000000

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

BGA54,6X9,30

Operating Temperature-Min

-30 °C

Access Time-Max

70 ns

Operating Temperature-Max

85 °C

Rohs Code

有

Manufacturer Part Number

MT45W8MW16BGX-708WTES

Number of Words

8388608 words

Supply Voltage-Nom (Vsup)

1.8 V

Package Code

FBGA

Package Shape

RECTANGULAR

Manufacturer

Micron Technology Inc

Part Life Cycle Code

Obsolete

Ihs Manufacturer

MICRON TECHNOLOGY INC

Risk Rank

5.84

子类别

其他存储器集成电路

技术

CMOS

端子位置

BOTTOM

终端形式

BALL

端子间距

0.75 mm

JESD-30代码

R-PBGA-B54

资历状况

不合格

电源

1.8 V

温度等级

OTHER

电源电流-最大值

0.035 mA

组织结构

8MX16

输出特性

3-STATE

内存宽度

16

待机电流-最大值

0.0002 A

记忆密度

134217728 bit

I/O类型

COMMON

达到SVHC

compliant