Micron Technology MT4LSDT1664AG-133G1

表面安装

NO

终端数量

168

ECCN (US)

EAR99

Module

DRAM模块

Module Density

128Mbyte

Number of Chip per Module

4

Chip Density (bit)

256M

Data Bus Width (bit)

64

Max. Access Time (ns)

5.4

Maximum Clock Rate (MHz)

133

Chip Configuration

16Mx16

Minimum Operating Supply Voltage (V)

3

Typical Operating Supply Voltage (V)

3.3

Maximum Operating Supply Voltage (V)

3.6

Operating Current (mA)

540

Minimum Operating Temperature (°C)

0

Maximum Operating Temperature (°C)

65

Supplier Temperature Grade

Commercial

Module Sides

Single

ECC Support

无

Number of Ranks

Single

Number of Chip Banks

4

CAS Latency

3

PC Type

PC-133

SPD EEPROM Support

有

Standard Package Name

DIM

Supplier Package

DIMM

Mounting

Socket

Package Height

25.53(Max)

Package Length

133.5(Max)

Package Width

3.18(Max)

PCB changed

168

Lead Shape

No Lead

Package Description

DIMM, DIMM168

Package Style

微电子组件

Number of Words Code

16000000

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

DIMM168

Access Time-Max

5.4 ns

Operating Temperature-Max

65 °C

Rohs Code

有

Manufacturer Part Number

MT4LSDT1664AG-133G1

Clock Frequency-Max (fCLK)

133 MHz

Number of Words

16777216 words

Supply Voltage-Nom (Vsup)

3.3 V

Package Code

DIMM

Package Shape

RECTANGULAR

Manufacturer

Micron Technology Inc

Part Life Cycle Code

活跃

Ihs Manufacturer

MICRON TECHNOLOGY INC

Risk Rank

5.68

包装

Tray

零件状态

Unconfirmed

技术

CMOS

端子位置

DUAL

终端形式

无铅

端子间距

1.27 mm

Reach合规守则

compliant

引脚数量

168

JESD-30代码

R-PDMA-N168

资历状况

不合格

电源

3.3 V

温度等级

COMMERCIAL

电源电流-最大值

1.08 mA

组织结构

16Mx64

输出特性

3-STATE

内存宽度

64

待机电流-最大值

0.008 A

记忆密度

1073741824 bit

锁相环

无

I/O类型

COMMON

内存IC类型

同步电机模块

刷新周期

8K

自我刷新

有

模块类型

168UDIMM

RoHS状态

RoHS non-compliant