Micron Technology MT4LSDT1664AG-13EG1

ECCN (US)

EAR99

Module

DRAM模块

Module Density

128Mbyte

Number of Chip per Module

4

Chip Density (bit)

256M

Data Bus Width (bit)

64

Max. Access Time (ns)

5.4

Maximum Clock Rate (MHz)

133

Chip Configuration

16Mx16

Minimum Operating Supply Voltage (V)

3

Typical Operating Supply Voltage (V)

3.3

Maximum Operating Supply Voltage (V)

3.6

Operating Current (mA)

540

Minimum Operating Temperature (°C)

0

Maximum Operating Temperature (°C)

65

Supplier Temperature Grade

Commercial

Module Sides

Single

ECC Support

无

Number of Ranks

Single

Number of Chip Banks

4

CAS Latency

2

PC Type

PC-133

SPD EEPROM Support

有

Standard Package Name

DIM

Supplier Package

DIMM

Mounting

Socket

Package Height

25.53(Max)

Package Length

133.5(Max)

Package Width

3.18(Max)

PCB changed

168

Lead Shape

No Lead

包装

Tray

零件状态

Unconfirmed

引脚数量

168

组织结构

16Mx64

锁相环

无

刷新周期

8K

自我刷新

有

模块类型

168UDIMM

RoHS状态

RoHS non-compliant