Micron Technology MT8HTF12864HTY-667E1

ECCN (US)

4A994.a

HTS

8542.32.00.32

Module

DRAM模块

Module Density

1Gbyte

Number of Chip per Module

8

Chip Density (bit)

1G

Data Bus Width (bit)

64

Maximum Clock Rate (MHz)

667

Chip Configuration

64Mx16

Minimum Operating Supply Voltage (V)

1.7

Typical Operating Supply Voltage (V)

1.8

Maximum Operating Supply Voltage (V)

1.9

Operating Current (mA)

900

Minimum Operating Temperature (°C)

-40

Maximum Operating Temperature (°C)

85

Supplier Temperature Grade

Industrial

Module Sides

Double

ECC Support

无

Number of Ranks

Dual

Number of Chip Banks

8

CAS Latency

5

PC Type

PC2-5300

SPD EEPROM Support

有

Standard Package Name

DIM

Supplier Package

SODIMM

Mounting

Socket

Package Height

31.15(Max)

Package Length

67.75(Max)

Package Width

3.8(Max)

PCB changed

200

Lead Shape

No Lead

包装

Tray

零件状态

Obsolete

引脚数量

200

组织结构

128Mx64

锁相环

无

刷新周期

8K

自我刷新

有

模块类型

200SODIMM

RoHS状态

符合RoHS标准