Micron Technology MT8HTF12864HZ-667G1

Module

DRAM模块

Module Density

1Gbyte

Number of Chip per Module

8

Chip Density (bit)

1G

Data Bus Width (bit)

64

Maximum Clock Rate (MHz)

667

Chip Configuration

128Mx8

Minimum Operating Supply Voltage (V)

1.7

Typical Operating Supply Voltage (V)

1.8

Maximum Operating Supply Voltage (V)

1.9

Operating Current (mA)

1080

Minimum Operating Temperature (°C)

0

Maximum Operating Temperature (°C)

70

Supplier Temperature Grade

Commercial

Module Sides

Double

Lead Shape

No Lead

PCB changed

200

Package Width

3.8(Max)

Package Length

67.75(Max)

Package Height

30.15(Max)

Mounting

Socket

Supplier Package

SODIMM

Standard Package Name

DIM

SPD EEPROM Support

有

PC Type

PC2-5300

CAS Latency

5

Number of Chip Banks

8

Number of Ranks

Single

ECC Support

无

ECCN (US)

EAR99

包装

Tray

零件状态

Obsolete

引脚数量

200

组织结构

128Mx64

锁相环

无

刷新周期

8K

自我刷新

有

模块类型

200SODIMM

RoHS状态

是,有豁免