Micron Technology MT8JSF12864HY-1G1D1

表面安装

NO

终端数量

204

ECCN (US)

EAR99

HTS

8542.32.00.41

Module

DRAM模块

Module Density

1Gbyte

Number of Chip per Module

8

Chip Density (bit)

1G

Data Bus Width (bit)

64

Maximum Clock Rate (MHz)

1066

Chip Configuration

128Mx8

Minimum Operating Supply Voltage (V)

1.425

Typical Operating Supply Voltage (V)

1.5

Maximum Operating Supply Voltage (V)

1.575

Operating Current (mA)

1520

Minimum Operating Temperature (°C)

0

Maximum Operating Temperature (°C)

70

Supplier Temperature Grade

Commercial

ECC Support

无

Number of Ranks

Single

CAS Latency

7

Standard Package Name

DIM

Supplier Package

SODIMM

Mounting

Socket

Package Height

30.15(Max)

Package Length

67.75(Max)

Package Width

3.8(Max)

PCB changed

204

Lead Shape

No Lead

Package Description

DIMM, DIMM204,24

Package Style

微电子组件

Number of Words Code

128000000

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

DIMM204,24

Operating Temperature-Max

70 °C

Rohs Code

有

Manufacturer Part Number

MT8JSF12864HY-1G1D1

Clock Frequency-Max (fCLK)

533 MHz

Number of Words

134217728 words

Package Code

DIMM

Package Shape

RECTANGULAR

Manufacturer

Micron Technology Inc

Part Life Cycle Code

Obsolete

Ihs Manufacturer

MICRON TECHNOLOGY INC

Risk Rank

5.82

包装

Tray

零件状态

Obsolete

技术

CMOS

端子位置

DUAL

终端形式

无铅

端子间距

0.6 mm

Reach合规守则

unknown

引脚数量

204

JESD-30代码

R-PDMA-N204

资历状况

不合格

电源

1.5,3.3 V

温度等级

COMMERCIAL

电源电流-最大值

3.12 mA

组织结构

128Mx64

输出特性

3-STATE

内存宽度

64

待机电流-最大值

0.08 A

记忆密度

8589934592 bit

I/O类型

COMMON

内存IC类型

DDR内存模块

刷新周期

8192

模块类型

204SODIMM

RoHS状态

是,有豁免