Micron Technology MT8JTF51264HDZ-1G4D1

ECCN (US)

EAR99

HTS

8473.30.11.40

Module

DRAM模块

Module Density

4Gbyte

Number of Chip per Module

8

Chip Density (bit)

4G

Data Bus Width (bit)

64

Maximum Clock Rate (MHz)

1333

Chip Configuration

256Mx16

Minimum Operating Supply Voltage (V)

1.425

Typical Operating Supply Voltage (V)

1.5

Maximum Operating Supply Voltage (V)

1.575

Operating Current (mA)

1040

Minimum Operating Temperature (°C)

0

Maximum Operating Temperature (°C)

70

Supplier Temperature Grade

Commercial

Module Sides

Double

ECC Support

无

Number of Ranks

Dual

Number of Chip Banks

8

CAS Latency

9

PC Type

PC3-10600

SPD EEPROM Support

有

Standard Package Name

DIM

Supplier Package

SODIMM

Mounting

Socket

Package Height

30.15(Max)

Package Length

67.75(Max)

Package Width

3.8(Max)

PCB changed

204

Lead Shape

No Lead

零件状态

Obsolete

引脚数量

204

组织结构

512Mx64

锁相环

无

刷新周期

8K

自我刷新

有

模块类型

204SODIMM

RoHS状态

是,有豁免