Micron Technology MT8LSDT1664AG-13EG1

ECCN (US)

EAR99

Module

DRAM模块

Module Density

128Mbyte

Number of Chip per Module

8

Chip Density (bit)

128M

Data Bus Width (bit)

64

Max. Access Time (ns)

5.4

Maximum Clock Rate (MHz)

133

Chip Configuration

16Mx8

Minimum Operating Supply Voltage (V)

3

Typical Operating Supply Voltage (V)

3.3

Maximum Operating Supply Voltage (V)

3.6

Operating Current (mA)

1320

Minimum Operating Temperature (°C)

0

Maximum Operating Temperature (°C)

65

Supplier Temperature Grade

Commercial

ECC Support

无

Number of Ranks

Single

CAS Latency

2

Standard Package Name

DIM

Supplier Package

UDIMM

Mounting

Socket

Package Height

35.05(Max)

Package Length

133.5(Max)

Package Width

3.99(Max)

PCB changed

168

Lead Shape

No Lead

包装

Tray

零件状态

Obsolete

引脚数量

168

组织结构

16Mx64

模块类型

168UDIMM

RoHS状态

RoHS non-compliant