Micron Technology MT9HTF12872FY-667G1D6

底架

Socket

引脚数

240

ECCN (US)

EAR99

HTS

8542.32.00.32

Module

DRAM模块

Module Density

1Gbyte

Number of Chip per Module

9

Chip Density (bit)

1G

Data Bus Width (bit)

72

Maximum Clock Rate (MHz)

667

Chip Configuration

128Mx8

Minimum Operating Supply Voltage (V)

1.7

Typical Operating Supply Voltage (V)

1.8

Maximum Operating Supply Voltage (V)

1.9

Minimum Operating Temperature (°C)

0

Maximum Operating Temperature (°C)

95

Module Sides

Double

ECC Support

有

Number of Ranks

Single

Number of Chip Banks

8

CAS Latency

5

PC Type

PC2-5300

SPD EEPROM Support

有

Standard Package Name

DIM

Supplier Package

FBDIMM

Mounting

Socket

Package Height

30.5(Max)

Package Length

133.5(Max)

Package Width

5.1(Max)

PCB changed

240

Lead Shape

No Lead

Maximum Clock Rate

667(MHz)

Sub-Category

DDR2 SDRAM

Operating Temperature (Max.)

95C

Total Density

1GByte(b)

Operating Temperature Classification

Commercial

Package Type

FBDIMM

Operating Temp Range

0C to 95C

Number of Elements

9

Device Core Size

72(b)

Operating Supply Voltage (Max)

1.9(V)

Operating Supply Voltage (Typ)

1.8(V)

Rad Hardened

无

Operating Supply Voltage (Min)

1.7(V)

Operating Temperature (Min.)

0C

Main Category

DRAM模块

Schedule B

8473300002, 8473300002/8473300002/8473300002/8473300002/8473300002

RoHS

Compliant

包装

Tray

零件状态

Obsolete

最高工作温度

95 °C

最小工作温度

0 °C

引脚数量

240

工作电源电压

1.8 V

最大电源电压

1.9 V

最小电源电压

1.7 V

组织结构

128Mx72

最高频率

667 MHz

锁相环

无

刷新周期

8K

自我刷新

无

模块类型

240FBDIMM

RoHS状态

是,有豁免

辐射硬化

无