Micron Technology MT9HVF6472PKY-667F1

ECCN (US)

EAR99

HTS

8542.32.00.28

Module

DRAM模块

Module Density

512Mbyte

Number of Chip per Module

9

Chip Density (bit)

512M

Data Bus Width (bit)

72

Max. Access Time (ns)

0.045

Maximum Clock Rate (MHz)

667

Chip Configuration

64Mx8

Minimum Operating Supply Voltage (V)

1.7

Typical Operating Supply Voltage (V)

1.8

Maximum Operating Supply Voltage (V)

1.9

Operating Current (mA)

1620

Minimum Operating Temperature (°C)

0

Maximum Operating Temperature (°C)

70

Supplier Temperature Grade

Commercial

Module Sides

Double

ECC Support

有

Number of Ranks

Single

Number of Chip Banks

4

CAS Latency

5

PC Type

PC2-5300

SPD EEPROM Support

有

Standard Package Name

DIM

Supplier Package

VLP Mini-RDIMM

Mounting

Socket

Package Height

18.3(Max)

Package Length

82.13(Max)

Package Width

3.8(Max)

PCB changed

244

Lead Shape

No Lead

包装

Tray

零件状态

Obsolete

引脚数量

244

组织结构

64Mx72

锁相环

有

刷新周期

8K

自我刷新

有

模块类型

244MiniRDIMM

RoHS状态

是,有豁免