Micron Technology MTA18ADF4G72PZ-3G2B1.001

Mounting

Socket

Package Height

18.9(Max)

Package Length

133.48(Max)

Package Width

3.9(Max)

PCB changed

288

ECCN (US)

4A994.a

HTS

8473.30.11.40

Module

DRAM模块

Module Density

32Gbyte

Chip Density (bit)

16G

Data Bus Width (bit)

72

Maximum Clock Rate (MHz)

3200

Chip Configuration

4Gx4

Minimum Operating Supply Voltage (V)

1.14

Typical Operating Supply Voltage (V)

1.2

Maximum Operating Supply Voltage (V)

1.26

Operating Current (mA)

3096

Minimum Operating Temperature (°C)

0

Maximum Operating Temperature (°C)

95

Supplier Temperature Grade

Commercial

Module Sides

Double

ECC Support

有

Number of Ranks

Single

Number of Chip Banks

16

CAS Latency

22

PC Type

PC4-3200

SPD EEPROM Support

有

Supplier Package

VLP RDIMM

零件状态

NRND

引脚数量

288

组织结构

4Gx72

锁相环

有

自我刷新

有

模块类型

288VLP RDIMM