Micron Technology NAND08GAH0JZC5F

表面安装

YES

终端数量

153

Ihs Manufacturer

MICRON TECHNOLOGY INC

Manufacturer

Micron Technology Inc

Manufacturer Part Number

NAND08GAH0JZC5F

Operating Temperature-Max

85 °C

Operating Temperature-Min

-25 °C

Package Body Material

PLASTIC/EPOXY

Package Code

FBGA

Package Description

FBGA, BGA153,14X14,20

Package Equivalence Code

BGA153,14X14,20

Package Shape

SQUARE

Package Style

GRID ARRAY, FINE PITCH

Part Life Cycle Code

Obsolete

Risk Rank

5.83

Rohs Code

有

子类别

其他存储器集成电路

技术

CMOS

端子位置

BOTTOM

终端形式

BALL

端子间距

0.5 mm

Reach合规守则

unknown

JESD-30代码

S-PBGA-B153

资历状况

不合格

电源

1.8/3.3,3.3 V

温度等级

OTHER

电源电流-最大值

0.15 mA

记忆密度

8589934592 bit