Micron Technology NANDA9R3N0AZQA5E

表面安装

YES

终端数量

152

Ihs Manufacturer

MICRON TECHNOLOGY INC

Manufacturer

Micron Technology Inc

Manufacturer Part Number

NANDA9R3N0AZQA5E

Operating Temperature-Max

85 °C

Operating Temperature-Min

-30 °C

Package Body Material

PLASTIC/EPOXY

Package Code

FBGA

Package Description

FBGA, BGA152,21X21,25

Package Equivalence Code

BGA152,21X21,25

Package Shape

SQUARE

Package Style

GRID ARRAY, FINE PITCH

Part Life Cycle Code

活跃

Risk Rank

5.3

Rohs Code

有

Supply Voltage-Nom (Vsup)

1.8 V

子类别

其他存储器集成电路

端子位置

BOTTOM

终端形式

BALL

端子间距

0.635 mm

Reach合规守则

compliant

JESD-30代码

S-PBGA-B152

资历状况

不合格

电源

1.8 V

温度等级

OTHER

内存IC类型

存储器电路

混合内存类型

FLASH+SDRAM