Microsemi MD54SC374AF

表面安装

NO

终端数量

20

Package Style

IN-LINE

Package Body Material

CERAMIC

Package Equivalence Code

DIP20,.3

Operating Temperature-Min

-55 °C

Operating Temperature-Max

125 °C

Rohs Code

无

Manufacturer Part Number

MD54SC374AF

Package Code

DIP

Package Shape

RECTANGULAR

Manufacturer

Microsemi Corporation

Part Life Cycle Code

Obsolete

Ihs Manufacturer

MICROSEMI CORP

Risk Rank

5.83

子类别

FF/Latches

技术

CMOS

端子位置

DUAL

终端形式

THROUGH-HOLE

功能数量

8

端子间距

2.54 mm

Reach合规守则

unknown

JESD-30代码

R-XDIP-T20

资历状况

不合格

温度等级

MILITARY

输出特性

3-STATE

逻辑IC类型

D FLIP-FLOP

最大 I(ol)

0.0065 A

触发器类型

积极优势