Microsemi Actel A1425A-1PG133C

表面安装

NO

终端数量

133

Package Description

HPGA,

Package Style

GRID ARRAY, HEAT SINK/SLUG

Package Body Material

CERAMIC, METAL-SEALED COFIRED

Supply Voltage-Nom

5 V

Supply Voltage-Min

4.75 V

Operating Temperature-Max

70 °C

Rohs Code

无

Manufacturer Part Number

A1425A-1PG133C

Clock Frequency-Max

150 MHz

Package Code

HPGA

Package Shape

SQUARE

Manufacturer

Microsemi Corporation

Part Life Cycle Code

Obsolete

Ihs Manufacturer

MICROSEMI CORP

Supply Voltage-Max

5.25 V

Risk Rank

5.91

技术

CMOS

端子位置

PERPENDICULAR

终端形式

PIN/PEG

端子间距

2.54 mm

Reach合规守则

compliant

JESD-30代码

S-CPGA-P133

温度等级

COMMERCIAL

组织结构

310 CLBS, 2500 GATES

座位高度-最大

8.13 mm

可编程逻辑类型

现场可编程门阵列

CLB-Max的组合延时

2.6 ns

逻辑块数量

310

等效门数

2500

宽度

34.544 mm

长度

34.544 mm