Microsemi Corporation PM7348-PGI

表面安装

YES

终端数量

324

Rohs Code

有

Part Life Cycle Code

Obsolete

Ihs Manufacturer

MICROSEMI CORP

Package Style

网格排列

Package Shape

SQUARE

Package Equivalence Code

BGA324,22X22,40

Package Code

BGA

Package Body Material

PLASTIC/EPOXY

Operating Temperature-Min

-40 °C

Operating Temperature-Max

85 °C

HTS代码

8542.39.00.01

端子位置

BOTTOM

终端形式

BALL

端子间距

1 mm

Reach合规守则

compliant

JESD-30代码

S-PBGA-B324

资历状况

不合格

温度等级

INDUSTRIAL

电源电流-最大值

190 mA