Molex 0511LA

表面安装

YES

终端数量

144

Manufacturer Part Number

ML70511LA

Rohs Code

无

Part Life Cycle Code

Obsolete

Ihs Manufacturer

LAPIS SEMICONDUCTOR CO LTD

Package Description

FBGA, BGA144,13X13,32

Risk Rank

5.92

Operating Temperature-Max

85 °C

Operating Temperature-Min

-40 °C

Package Body Material

PLASTIC/EPOXY

Package Code

FBGA

Package Equivalence Code

BGA144,13X13,32

Package Shape

SQUARE

Package Style

GRID ARRAY, FINE PITCH

Supply Voltage-Nom

3.3 V

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

端子位置

BOTTOM

终端形式

BALL

端子间距

0.8 mm

Reach合规守则

unknown

JESD-30代码

S-PBGA-B144

资历状况

不合格

电源

3.3 V

温度等级

INDUSTRIAL

电源电流-最大值

70 mA