Molex 53364-3071

生命周期状态

Production (Last Updated: 2 years ago)

触点镀层

Tin

安装类型

BOARD

房屋材料

Thermoplastic (TP)

Product Status

活跃

Voltage, Rating

50 V

Maximum Operating Temperature

+ 105 C

Unit Weight

0.024187 oz

Minimum Operating Temperature

- 40 C

Factory Pack QuantityFactory Pack Quantity

1000

Contact Materials

Copper

Part # Aliases

0533643071

Manufacturer

Molex

Brand

Molex

Tradename

SlimStack

RoHS

Details

Country of Origin

JP

Manufacturer Lifecycle Status

ACTIVE (Last Updated: 2 years ago)

Package Description

LEAD FREE

Contact Finish Mating

镍镀锡

Operating Temperature-Min

-40 °C

Operating Temperature-Max

105 °C

Rohs Code

有

Manufacturer Part Number

53364-3071

Mounting Styles

STRAIGHT

Number of Rows Loaded

2

Part Life Cycle Code

活跃

Samacsys Description

Board to Board & Mezzanine Connectors 0.8 BtB WaferAssySTW /OBoss30CktEmbsTpPkg

Ihs Manufacturer

MOLEX LLC

Risk Rank

1.77

系列

53364

包装

MouseReel

JESD-609代码

e3

无铅代码

有

终端

SMD/SMT

连接器类型

板堆叠连接器

定位的数量

30 Position

应用

Board-to-Board

行数

2 Row

性别

Male

子类别

Board to Board & Mezzanine Connectors

MIL一致性

NO

符合 DIN 标准

NO

IEC一致性

NO

过滤功能

NO

混合接触

NO

选项

GENERAL PURPOSE

螺距

0.8 mm

触头总数

30

方向

Vertical

端子间距

0.8 mm

Reach合规守则

compliant

额定电流

500 mA

终端样式

Solder

接头数量

30

配套信息

MULTIPLE MATING PARTS AVAILABLE

触点性别

FEMALE

UL可燃性规范

94V-0

电路数量

30

终端类型

SURFACE MOUNT

镀层

Tin

触点表面处理 终端

镍镀锡

产品类别

Board to Board & Mezzanine Connectors

符合辉光线

Non-compliant

产品

Headers

安装角

Vertical

产品类别

Board to Board & Mezzanine Connectors

叠层高度

6 mm, 7 mm

达到SVHC

Unknown

辐射硬化

无