Molex M3765

表面安装

NO

终端数量

16

Ihs Manufacturer

MOSDESIGN SEMICONDUCTOR CORP

Manufacturer

Mosdesign Semiconductor Corp

Manufacturer Part Number

M3765

Operating Temperature-Max

60 °C

Package Body Material

PLASTIC/EPOXY

Package Code

DIP

Package Description

DIP, DIP16(UNSPEC)

Package Equivalence Code

DIP16(UNSPEC)

Package Shape

RECTANGULAR

Package Style

IN-LINE

Part Life Cycle Code

接触制造商

Risk Rank

5.76

Rohs Code

无

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

子类别

音频合成器集成电路

端子位置

DUAL

终端形式

THROUGH-HOLE

Reach合规守则

unknown

JESD-30代码

R-PDIP-T16

资历状况

不合格

电源

3 V

温度等级

COMMERCIAL