MOTOROLA 55107/BCBJC

表面安装

NO

终端数量

14

Supply Voltage-Nom

5 V

Package Style

IN-LINE

Package Shape

RECTANGULAR

Package Equivalence Code

DIP14,.3

Package Code

DIP

Package Body Material

CERAMIC

Operating Temperature-Min

-55 °C

Operating Temperature-Max

125 °C

Risk Rank

5.92

Package Description

DIP, DIP14,.3

Ihs Manufacturer

MOTOROLA SEMICONDUCTOR PRODUCTS

Part Life Cycle Code

Obsolete

Rohs Code

无

Manufacturer Part Number

55107/BCBJC

Usage Level

Military grade

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

端子位置

DUAL

终端形式

THROUGH-HOLE

端子间距

2.54 mm

Reach合规守则

unknown

JESD-30代码

R-XDIP-T14

资历状况

不合格

电源

+-5 V

温度等级

MILITARY

电源电流-最大值

30 mA

筛选水平

38535Q/M;38534H;883B

接收延迟-最大

40 ns

负供电电压

-5 V

输出低电流-最大值

0.016 A