MOTOROLA MC14021BCPD

表面安装

NO

终端数量

16

Manufacturer

Qualcomm RF360

Brand

RF360

RoHS

Details

Factory Pack QuantityFactory Pack Quantity

3000

Package Description

DIP, DIP16,.3

Package Style

IN-LINE

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

DIP16,.3

Operating Temperature-Min

-40 °C

Operating Temperature-Max

85 °C

Rohs Code

无

Manufacturer Part Number

MC14021BCPD

Package Code

DIP

Package Shape

RECTANGULAR

Part Life Cycle Code

Obsolete

Ihs Manufacturer

MOTOROLA SEMICONDUCTOR PRODUCTS

Risk Rank

5.9

包装

Reel

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

子类别

Filters

技术

CMOS

端子位置

DUAL

终端形式

THROUGH-HOLE

功能数量

1

端子间距

2.54 mm

JESD-30代码

R-PDIP-T16

电源

5/15 V

温度等级

INDUSTRIAL

比特数

8

产品类别

信号调理

产品类别

信号调理

达到SVHC

unknown