MOTOROLA MC68B54PD

表面安装

NO

终端数量

28

Package Description

DIP, DIP28,.6

Package Style

IN-LINE

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

DIP28,.6

Operating Temperature-Max

70 °C

Rohs Code

无

Manufacturer Part Number

MC68B54PD

Package Code

DIP

Package Shape

RECTANGULAR

Manufacturer

飞思卡尔半导体

Part Life Cycle Code

Obsolete

Ihs Manufacturer

MOTOROLA SEMICONDUCTOR PRODUCTS

Risk Rank

5.92

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

子类别

Serial IO/Communication Controllers

技术

MOS

端子位置

DUAL

终端形式

THROUGH-HOLE

端子间距

2.54 mm

JESD-30代码

R-PDIP-T28

温度等级

COMMERCIAL

uPs/uCs/外围ICs类型

SERIAL IO/COMMUNICATION CONTROLLER, MULTI PROTOCOL

达到SVHC

unknown