MOTOROLA MC68HC811E2/BXAJC

表面安装

NO

终端数量

68

Package Description

SDIP, SDIP68,.6

Package Style

IN-LINE, SHRINK PITCH

Package Body Material

CERAMIC

Package Equivalence Code

SDIP68,.6

Operating Temperature-Min

-55 °C

Supply Voltage-Nom

5 V

Operating Temperature-Max

125 °C

Rohs Code

无

Manufacturer Part Number

MC68HC811E2/BXAJC

Package Code

SDIP

Package Shape

RECTANGULAR

Manufacturer

飞思卡尔半导体

ROM(word)

0

Part Life Cycle Code

Obsolete

Ihs Manufacturer

MOTOROLA SEMICONDUCTOR PRODUCTS

Risk Rank

5.92

Usage Level

Military grade

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

子类别

Microcontrollers

技术

CMOS

端子位置

DUAL

终端形式

THROUGH-HOLE

端子间距

1.78 mm

JESD-30代码

R-XDIP-T68

资历状况

不合格

电源

5 V

温度等级

MILITARY

位元大小

8

处理器系列

6800

筛选水平

38535Q/M;38534H;883B

达到SVHC

unknown