MOTOROLA XPC107APX100L

表面安装

YES

终端数量

503

Manufacturer Part Number

XPC107APX100L

Rohs Code

无

Part Life Cycle Code

Obsolete

Ihs Manufacturer

MOTOROLA SEMICONDUCTOR PRODUCTS

Package Description

BGA, BGA503,25X25,50

Risk Rank

5.91

Package Body Material

PLASTIC/EPOXY

Package Code

BGA

Package Equivalence Code

BGA503,25X25,50

Package Shape

SQUARE

Package Style

网格排列

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

端子位置

BOTTOM

终端形式

BALL

端子间距

1.27 mm

Reach合规守则

unknown

JESD-30代码

S-PBGA-B503

资历状况

不合格

电源

2.5,2.5/3.3,3.3 V