MOTOROLA XPC107ARX100L

表面安装

YES

终端数量

503

Manufacturer Part Number

XPC107ARX100L

Rohs Code

无

Part Life Cycle Code

Obsolete

Ihs Manufacturer

MOTOROLA SEMICONDUCTOR PRODUCTS

Package Description

BGA, BGA503,25X25,50

Risk Rank

5.92

Package Body Material

CERAMIC

Package Code

BGA

Package Equivalence Code

BGA503,25X25,50

Package Shape

SQUARE

Package Style

网格排列

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

端子位置

BOTTOM

终端形式

BALL

端子间距

1.27 mm

Reach合规守则

unknown

JESD-30代码

S-XBGA-B503

资历状况

不合格

电源

2.5,2.5/3.3,3.3 V