Motorola Semiconductor Products DTC114YE

表面安装

YES

材料

synthetic polyolefin

终端数量

3

晶体管元件材料

SILICON

外壳材料

1

Rohs Code

无

Part Life Cycle Code

Transferred

Ihs Manufacturer

MOTOROLA INC

Package Body Material

PLASTIC/EPOXY

Package Shape

RECTANGULAR

Package Style

小概要

Gross weight

40.86

Transport packaging size/quantity

102*20*20/405

Wall thickness after shrinkage

0.95 mm

Wall thickness before shrinkage

0.55 mm

Diameter after shrinkage

15.0 mm

Diameter before shrinkage

31.5 mm

Diameter of protected wire (cable)

16…29 mm

包装

in 1m cut packs

JESD-609代码

e0

ECCN 代码

EAR99

类型

Heat shrink tube without adhesive

端子表面处理

Tin/Lead (Sn/Pb)

颜色

blue

附加功能

BUILT IN BIAS RESISTOR RATIO 4.7

端子位置

DUAL

终端形式

鸥翼

Reach合规守则

unknown

JESD-30代码

R-PDSO-G3

资历状况

不合格

配置

SINGLE WITH BUILT-IN RESISTOR

晶体管应用

SWITCHING

极性/通道类型

NPN

Operating temperature range

-55…+125 °C

Shrink temperature

+70…+120 °C

集电极电流-最大值(IC)

0.1 A

最小直流增益（hFE）

80

集电极-发射器电压-最大值

50 V

Operating voltage

600 V

Shrink ratio

2 : 1