Motorola Semiconductor Products MC14106BCL

表面安装

NO

Housing material

glass

终端数量

14

Gross weight

0.82

Transport packaging size/quantity

48*31.5*22/10000

Mounting method

DIP

Rohs Code

无

Part Life Cycle Code

Obsolete

Ihs Manufacturer

MOTOROLA INC

Package Description

DIP,

Load Capacitance (CL)

50 pF

Operating Temperature-Max

125 °C

Operating Temperature-Min

-55 °C

Package Body Material

CERAMIC, GLASS-SEALED

Package Code

DIP

Package Shape

RECTANGULAR

Package Style

IN-LINE

Supply Voltage-Nom (Vsup)

5 V

Time

(max) tripping at I=2.75 x I nominal - 2s

Operating temperature

-60…+85 °C

JESD-609代码

e0

端子表面处理

锡铅

HTS代码

8542.39.00.01

端子位置

DUAL

终端形式

THROUGH-HOLE

功能数量

6

端子间距

2.54 mm

深度

20 mm

Reach合规守则

unknown

JESD-30代码

R-GDIP-T14

资历状况

不合格

电源电压-最大值(Vsup)

18 V

温度等级

MILITARY

电源电压-最小值(Vsup)

3 V

家人

4000/14000/40000

输入数量

1

Fuse type

Cartridge fuse with wire leads (RT)

座位高度-最大

5.08 mm

Rated current

5 A

逻辑IC类型

INVERTER

传播延迟(tpd)

250 ns

Rated voltage

250 (AC) V

Housing diameter

5.2 mm

长度

19.495 mm

宽度

7.62 mm