Motorola Semiconductor Products MC664LDS

表面安装

NO

终端数量

14

Rohs Code

无

Part Life Cycle Code

Obsolete

Ihs Manufacturer

MOTOROLA INC

Operating Temperature-Max

70 °C

Operating Temperature-Min

-30 °C

Package Body Material

CERAMIC

Package Code

DIP

Package Equivalence Code

DIP14,.3

Package Shape

RECTANGULAR

Package Style

IN-LINE

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

HTS代码

8542.39.00.01

端子位置

DUAL

终端形式

THROUGH-HOLE

功能数量

1

端子间距

2.54 mm

Reach合规守则

unknown

JESD-30代码

R-XDIP-T14

温度等级

OTHER

逻辑IC类型

R-S FLIP-FLOP

触发器类型

MASTER-SLAVE