Multicomp 1MS1T2B4VS2RES

终端数量

2

Product Diameter (mm)

Not Required(mm)

Case Style

共形涂层

Operating Temp Range

-55C to 125C

Wire Form

不需要

DF

8%

Product Depth (mm)

4.3(mm)

Lead Spacing (nom)

Not Required(mm)

High Shock and Vibration

NO

Temperature Range @ Derated Voltage

85 TO 125

Rad Hardened

无

Seal

不需要

DCL

16(uA)

Tolerance (+ or -)

10%

Lead Diameter (nom)

Not Required(mm)

Length W/Weld

Not Required(mm)

Mounting Styles

表面贴装

Seated Plane Height

Not Required(mm)

Equivalent Series Resistance Type

LOW

包装

卷带

电容量

100000000(pF)

结构

SMT 芯片

终端样式

PAD

失败率

不需要

极性

Polar

电压

16VDC

照明

Non Illuminated

绝缘材料

不需要

等效串联电阻

0.15(ohm)

触点配置

单刀双掷

箱码

D

产品长度(mm)

7.5(mm)

产品高度(mm)

1.5(mm)