Multicomp 5504F1-09P-01-03-F1

安装类型

BOARD

外壳材料

METAL

Package

Box

Base Product Number

QB-352

厂商

Renesas Electronics America Inc

Product Status

Obsolete

For Use With/Related Products

Renesas MCUs

Package Description

LEAD FREE

Shell Sizes

1/E

Contact Finish Mating

镍镀金

Insulator Material

PLASTIC

Manufacturer Part Number

5504F1-09P-01-03-F1

Manufacturer

SPC Multicomp

Part Life Cycle Code

Obsolete

Ihs Manufacturer

SPC TECHNOLOGY/ MULTICOMP

Risk Rank

5.69

Manufacturer Series

5504

系列

-

JESD-609代码

e4

连接器类型

D 超微型连接器

MIL一致性

NO

符合 DIN 标准

NO

IEC一致性

NO

过滤功能

NO

混合接触

NO

选项

GENERAL PURPOSE

触头总数

9

Reach合规守则

unknown

外壳完成

TIN

配套信息

MULTIPLE MATING PARTS AVAILABLE

触点性别

MALE

空壳

NO

注意

-

主体/外壳样式

PLUG

终端类型

SOLDER

触点表面处理 终端

镍镀金

模块/板式

Socket Adapter