Multicomp MC000759

终端数量

2

Temperature Range @ Derated Voltage

85 TO 125

High Shock and Vibration

NO

Lead Spacing (nom)

Not Required(mm)

Product Depth (mm)

6.6(mm)

DF

10%

Wire Form

不需要

Operating Temp Range

-55C to 125C

Case Style

共形涂层

Product Diameter (mm)

Not Required(mm)

Mounting Styles

表面贴装

Length W/Weld

Not Required(mm)

Lead Diameter (nom)

Not Required(mm)

Tolerance (+ or -)

10%

DCL

66(uA)

Seal

不需要

Rad Hardened

无

Seated Plane Height

Not Required(mm)

Equivalent Series Resistance Type

ULTRA LOW

Manufacturer Part Number

MC000759

Manufacturer

SPC Multicomp

Part Life Cycle Code

接触制造商

Ihs Manufacturer

SPC TECHNOLOGY/ MULTICOMP

Risk Rank

5.25

包装

卷带

终端

Crimp

电容量

330000000(pF)

结构

SMT 芯片

Reach合规守则

unknown

终端样式

PAD

失败率

不需要

极性

Polar

电压

20VDC

端子和接线板类型

环形端子

绝缘材料

不需要

端子类型

压缩耳

等效串联电阻

0.1(ohm)

导线截面

50 mm2

箱码

H

产品长度(mm)

8(mm)

产品高度(mm)

5.2(mm)