Multicomp MC361F

表面安装

YES

终端数量

10

Package Description

DFP, FL10,.3

Package Style

FLATPACK

Package Body Material

CERAMIC

Package Equivalence Code

FL10,.3

Operating Temperature-Max

70 °C

Rohs Code

无

Manufacturer Part Number

MC361F

Package Code

DFP

Package Shape

RECTANGULAR

Manufacturer

摩托罗拉半导体产品

Part Life Cycle Code

Obsolete

Ihs Manufacturer

MOTOROLA INC

Risk Rank

5.92

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

子类别

Gates

技术

ECL

端子位置

DUAL

终端形式

FLAT

端子间距

1.27 mm

Reach合规守则

unknown

JESD-30代码

R-XDFP-F10

温度等级

COMMERCIAL

逻辑IC类型

NOR GATE

施密特触发器

NO