Multicomp MCU0805F104ZCT

包装/外壳

0805

终端数量

2

Product Depth (mm)

1.25(mm)

Wire Form

不需要

Operating Temp Range

-25C to 85C

Case Style

陶瓷芯片

Product Diameter (mm)

Not Required(mm)

Mounting Styles

表面贴装

Temp Coeff (Dielectric)

Y5V

Lead Diameter (nom)

Not Required(mm)

Tolerance (+ or -)

-20% to 80%

Rad Hardened

无

Microwave Application

YES

Seated Plane Height

Not Required(mm)

MSL

-

Qualification

-

Capacitance Tolerance

-20%, +80%

包装

卷带

电容量

100000PF(pF)

技术

STANDARD

结构

SMT 芯片

终端样式

PAD

失败率

不需要

电压

50VDC

产品长度

2.01mm

产品宽度

1.25mm

产品长度(mm)

2(mm)