National Semiconductor 54HC154/BLAJC

表面安装

NO

终端数量

24

Package Description

DIP, DIP24,.3

Package Style

IN-LINE

Package Body Material

CERAMIC

Package Equivalence Code

DIP24,.3

Operating Temperature-Min

-55 °C

Operating Temperature-Max

125 °C

Rohs Code

无

Manufacturer Part Number

54HC154/BLAJC

Package Code

DIP

Package Shape

RECTANGULAR

Manufacturer

飞思卡尔半导体

Part Life Cycle Code

Obsolete

Ihs Manufacturer

MOTOROLA SEMICONDUCTOR PRODUCTS

Risk Rank

5.92

Usage Level

Military grade

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

子类别

Decoder/Drivers

技术

CMOS

端子位置

DUAL

终端形式

THROUGH-HOLE

功能数量

1

端子间距

2.54 mm

JESD-30代码

R-XDIP-T24

资历状况

不合格

电源

2/6 V

温度等级

MILITARY

逻辑IC类型

OTHER DECODER/DRIVER

筛选水平

38535Q/M;38534H;883B

达到SVHC

unknown