National Semiconductor CD4019BMJ/883

表面安装

NO

终端数量

16

Operating Temperature-Max

125 °C

Operating Temperature-Min

-55 °C

Package Body Material

CERAMIC

Package Code

DIP

Package Equivalence Code

DIP16,.3

Package Shape

RECTANGULAR

Package Style

IN-LINE

Risk Rank

5.92

Package Description

DIP, DIP16,.3

Ihs Manufacturer

NATIONAL SEMICONDUCTOR CORP

Part Life Cycle Code

Obsolete

Rohs Code

无

Manufacturer Part Number

CD4019BMJ/883

Usage Level

Military grade

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

端子位置

DUAL

终端形式

THROUGH-HOLE

端子间距

2.54 mm

Reach合规守则

unknown

JESD-30代码

R-XDIP-T16

资历状况

不合格

电源

5/15 V

温度等级

MILITARY

逻辑IC类型

OR GATE

筛选水平

38535Q/M;38534H;883B

施密特触发器

NO