National Semiconductor DH0034D-MIL

表面安装

NO

终端数量

14

Package Description

DIP, DIP14,.3

Package Style

IN-LINE

Package Body Material

CERAMIC, METAL-SEALED COFIRED

Package Equivalence Code

DIP14,.3

Operating Temperature-Min

-55 °C

Operating Temperature-Max

125 °C

Rohs Code

无

Manufacturer Part Number

DH0034D-MIL

Package Code

DIP

Package Shape

RECTANGULAR

Manufacturer

Texas

Part Life Cycle Code

Obsolete

Ihs Manufacturer

NATIONAL SEMICONDUCTOR CORP

Risk Rank

5.81

Usage Level

Military grade

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

HTS代码

8542.39.00.01

子类别

Gates

技术

BIPOLAR

端子位置

DUAL

终端形式

THROUGH-HOLE

功能数量

2

端子间距

2.54 mm

Reach合规守则

unknown

JESD-30代码

R-CDIP-T14

资历状况

不合格

电源

5,-25 V

温度等级

MILITARY

输入数量

2

输出特性

OPEN-COLLECTOR

座位高度-最大

4.572 mm

逻辑IC类型

NAND GATE

筛选水平

MIL-STD-883 Class B (Modified)

宽度

7.62 mm