National Semiconductor DM54198J/883B

表面安装

NO

终端数量

24

Package Description

DIP, DIP24,.6

Package Style

IN-LINE

Package Body Material

CERAMIC

Package Equivalence Code

DIP24,.6

Operating Temperature-Min

-55 °C

Operating Temperature-Max

125 °C

Rohs Code

无

Manufacturer Part Number

DM54198J/883B

Package Code

DIP

Package Shape

RECTANGULAR

Manufacturer

National Semiconductor Corporation

Part Life Cycle Code

Obsolete

Ihs Manufacturer

NATIONAL SEMICONDUCTOR CORP

Max

25000000 Hz

Risk Rank

8.57

Usage Level

Military grade

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

子类别

移位寄存器

技术

TTL

端子位置

DUAL

终端形式

THROUGH-HOLE

功能数量

1

端子间距

2.54 mm

JESD-30代码

R-XDIP-T24

资历状况

不合格

温度等级

MILITARY

比特数

8

筛选水平

38535Q/M;38534H;883B

计数方向

BIDIRECTIONAL

达到SVHC

compliant