National Semiconductor DM9002CN

表面安装

NO

终端数量

14

Package Style

IN-LINE

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

DIP14,.3

Operating Temperature-Max

70 °C

Rohs Code

无

Manufacturer Part Number

DM9002CN

Package Code

DIP

Package Shape

RECTANGULAR

Manufacturer

National Semiconductor Corporation

Part Life Cycle Code

Obsolete

Ihs Manufacturer

NATIONAL SEMICONDUCTOR CORP

Risk Rank

8.79

Prop.

15 ns

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

子类别

Gates

技术

TTL

端子位置

DUAL

终端形式

THROUGH-HOLE

端子间距

2.54 mm

Reach合规守则

compliant

JESD-30代码

R-PDIP-T14

资历状况

不合格

温度等级

COMMERCIAL

逻辑IC类型

NAND GATE

最大 I(ol)

0.016 A

施密特触发器

NO

电源电流-最大值(ICC)

6.1 mA