National Semiconductor DS8861N

表面安装

NO

终端数量

18

Manufacturer Part Number

DS8861N

Rohs Code

无

Part Life Cycle Code

Obsolete

Ihs Manufacturer

NATIONAL SEMICONDUCTOR CORP

Risk Rank

5.89

Operating Temperature-Max

70 °C

Package Body Material

PLASTIC/EPOXY

Package Code

DIP

Package Equivalence Code

DIP18,.3

Package Shape

RECTANGULAR

Package Style

IN-LINE

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

附加功能

COMMON-CATHODE

端子位置

DUAL

终端形式

THROUGH-HOLE

端子间距

2.54 mm

Reach合规守则

compliant

JESD-30代码

R-PDIP-T18

资历状况

不合格

温度等级

COMMERCIAL

分段数

5

显示模式

SEGMENT