National Semiconductor LM1837

表面安装

NO

终端数量

18

Package Description

DIP, DIP18,.3

Package Style

IN-LINE

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

DIP18,.3

Operating Temperature-Max

70 °C

Rohs Code

无

Manufacturer Part Number

LM1837

Package Code

DIP

Package Shape

RECTANGULAR

Manufacturer

STMicroelectronics

Part Life Cycle Code

Obsolete

Ihs Manufacturer

STMICROELECTRONICS

Risk Rank

5.91

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

子类别

Audio/Video Amplifiers

技术

BIPOLAR

端子位置

DUAL

终端形式

THROUGH-HOLE

端子间距

2.54 mm

Reach合规守则

not_compliant

JESD-30代码

R-PDIP-T18

资历状况

不合格

电源

4/18 V

温度等级

COMMERCIAL

电源电流-最大值

15 mA