National Semiconductor LM48861TMX

表面安装

YES

终端数量

12

Package Description

FBGA, BGA12,3X4,16

Package Style

GRID ARRAY, FINE PITCH

Moisture Sensitivity Levels

1

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

BGA12,3X4,16

Operating Temperature-Min

-40 °C

Operating Temperature-Max

85 °C

Rohs Code

有

Manufacturer Part Number

LM48861TMX

Package Code

FBGA

Package Shape

RECTANGULAR

Manufacturer

Texas

Part Life Cycle Code

Obsolete

Ihs Manufacturer

NATIONAL SEMICONDUCTOR CORP

Risk Rank

5.84

JESD-609代码

e1

端子表面处理

Tin/Silver/Copper (Sn/Ag/Cu)

子类别

Audio/Video Amplifiers

端子位置

BOTTOM

终端形式

BALL

功能数量

1

端子间距

0.4 mm

JESD-30代码

R-PBGA-B12

资历状况

不合格

电源

1.5 V

温度等级

INDUSTRIAL

电源电流-最大值

2.8 mA

消费者集成电路类型

音频放大器

达到SVHC

compliant