National Semiconductor LMH2110TM

表面安装

YES

引脚数

6

终端数量

6

RoHS

Non-Compliant

Package Description

VFBGA,

Package Style

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Package Body Material

PLASTIC/EPOXY

Operating Temperature-Min

-40 °C

Supply Voltage-Nom

4.5 V

Operating Temperature-Max

85 °C

Manufacturer Part Number

LMH2110TM

Package Code

VFBGA

Package Shape

RECTANGULAR

Manufacturer

National Semiconductor Corporation

Part Life Cycle Code

Transferred

Ihs Manufacturer

NATIONAL SEMICONDUCTOR CORP

Risk Rank

5.31

HTS代码

8542.39.00.01

端子位置

BOTTOM

终端形式

BALL

功能数量

1

端子间距

0.4 mm

Reach合规守则

unknown

JESD-30代码

R-PBGA-B6

资历状况

不合格

温度等级

INDUSTRIAL

座位高度-最大

0.675 mm

通信IC类型

射频和基带电路

宽度

0.84 mm

长度

1.24 mm