National Semiconductor LP5523TMX

表面安装

YES

终端数量

25

Manufacturer Part Number

LP5523TMX

Rohs Code

有

Part Life Cycle Code

Obsolete

Ihs Manufacturer

NATIONAL SEMICONDUCTOR CORP

Package Description

FBGA, BGA25,5X5,16

Risk Rank

5.83

Moisture Sensitivity Levels

1

Operating Temperature-Max

85 °C

Operating Temperature-Min

-30 °C

Package Body Material

PLASTIC/EPOXY

Package Code

FBGA

Package Equivalence Code

BGA25,5X5,16

Package Shape

SQUARE

Package Style

GRID ARRAY, FINE PITCH

JESD-609代码

e1

端子表面处理

Tin/Silver/Copper (Sn/Ag/Cu)

端子位置

BOTTOM

终端形式

BALL

端子间距

0.4 mm

Reach合规守则

compliant

JESD-30代码

S-PBGA-B25

资历状况

不合格

电源

3/5 V

温度等级

OTHER