National Semiconductor MC74HC32N

表面安装

NO

终端数量

14

Manufacturer Part Number

371-03131

Approvals

CSA, UL

Manufacturer

Siemens Building Technologies

Package Style

IN-LINE

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

DIP14,.3

Operating Temperature-Min

-40 °C

Operating Temperature-Max

85 °C

Rohs Code

无

Package Code

DIP

Package Shape

RECTANGULAR

Part Life Cycle Code

Obsolete

Ihs Manufacturer

MOTOROLA INC

Risk Rank

8.79

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

子类别

Gates

技术

CMOS

端子位置

DUAL

终端形式

THROUGH-HOLE

端子间距

2.54 mm

Reach合规守则

unknown

JESD-30代码

R-PDIP-T14

资历状况

不合格

电源

2/6 V

温度等级

INDUSTRIAL

逻辑IC类型

OR GATE

施密特触发器

NO

连接类型

Threaded