National Semiconductor MM1101A1N

表面安装

NO

终端数量

16

Package

Bulk

厂商

Nexperia USA Inc.

Product Status

活跃

Risk Rank

8.78

Ihs Manufacturer

NATIONAL SEMICONDUCTOR CORP

Part Life Cycle Code

Obsolete

Manufacturer

National Semiconductor Corporation

Package Shape

RECTANGULAR

Package Code

DIP

Number of Words

256 words

Manufacturer Part Number

MM1101A1N

Rohs Code

无

Operating Temperature-Max

70 °C

Access Time-Max

1000 ns

Operating Temperature-Min

-25 °C

Package Equivalence Code

DIP16,.3

Package Body Material

PLASTIC/EPOXY

Number of Words Code

256

Package Style

IN-LINE

Package Description

DIP, DIP16,.3

系列

*

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

子类别

SRAMs

技术

MOS

端子位置

DUAL

终端形式

THROUGH-HOLE

端子间距

2.54 mm

Reach合规守则

compliant

JESD-30代码

R-PDIP-T16

资历状况

不合格

温度等级

OTHER

操作模式

ASYNCHRONOUS

组织结构

256X1

输出特性

3-STATE

内存宽度

1

并行/串行

PARALLEL

内存IC类型

标准SRAM