National Semiconductor MM1101A2D

表面安装

NO

终端数量

16

Package Description

DIP, DIP16,.3

Package Style

IN-LINE

Number of Words Code

256

Package Body Material

CERAMIC

Package Equivalence Code

DIP16,.3

Operating Temperature-Min

-25 °C

Access Time-Max

500 ns

Operating Temperature-Max

70 °C

Rohs Code

无

Manufacturer Part Number

MM1101A2D

Number of Words

256 words

Package Code

DIP

Package Shape

RECTANGULAR

Manufacturer

National Semiconductor Corporation

Part Life Cycle Code

Obsolete

Ihs Manufacturer

NATIONAL SEMICONDUCTOR CORP

Risk Rank

5.92

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

子类别

SRAMs

技术

MOS

端子位置

DUAL

终端形式

THROUGH-HOLE

端子间距

2.54 mm

Reach合规守则

compliant

JESD-30代码

R-XDIP-T16

资历状况

不合格

温度等级

OTHER

操作模式

ASYNCHRONOUS

组织结构

256X1

输出特性

3-STATE

内存宽度

1

并行/串行

PARALLEL

内存IC类型

标准SRAM