National Semiconductor MM46174BJ/883

表面安装

NO

Package Style

IN-LINE

Package Equivalence Code

DIP(UNSPEC)

Package Code

DIP

Package Body Material

CERAMIC

Risk Rank

5.87

Ihs Manufacturer

NATIONAL SEMICONDUCTOR CORP

Part Life Cycle Code

Obsolete

Rohs Code

无

Manufacturer Part Number

MM46174BJ/883

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

端子位置

DUAL

终端形式

THROUGH-HOLE

功能数量

6

Reach合规守则

compliant

资历状况

不合格

逻辑IC类型

D FLIP-FLOP