National Semiconductor MM74C175J

表面安装

NO

终端数量

16

RoHS

Non-Compliant

Package Description

DIP,

Package Style

IN-LINE

Package Body Material

CERAMIC, GLASS-SEALED

Operating Temperature-Min

-40 °C

Operating Temperature-Max

85 °C

Manufacturer Part Number

MM74C175J

Supply Voltage-Nom (Vsup)

5 V

Risk Rank

5.68

Ihs Manufacturer

ROCHESTER ELECTRONICS LLC

Part Life Cycle Code

活跃

Manufacturer

Rochester Electronics LLC

Package Shape

RECTANGULAR

Package Code

DIP

HTS代码

8542.39.00.01

技术

CMOS

端子位置

DUAL

终端形式

THROUGH-HOLE

功能数量

1

端子间距

2.54 mm

Reach合规守则

unknown

JESD-30代码

R-GDIP-T16

电源电压-最大值(Vsup)

15 V

温度等级

INDUSTRIAL

电源电压-最小值(Vsup)

3 V

比特数

4

家人

CMOS

座位高度-最大

5.08 mm

输出极性

COMPLEMENTARY

逻辑IC类型

D FLIP-FLOP

触发器类型

积极优势

传播延迟(tpd)

300 ns

fmax-Min

5 MHz

宽度

7.62 mm

长度

19.43 mm