NXP 74AHCT1G04GW

表面安装

YES

终端数量

5

Package Description

TSSOP, TSSOP5/6,.08

Package Style

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Moisture Sensitivity Levels

1

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

TSSOP5/6,.08

Operating Temperature-Min

-40 °C

Operating Temperature-Max

125 °C

Rohs Code

有

Manufacturer Part Number

74AHCT1G04GW

Supply Voltage-Nom (Vsup)

5 V

Package Code

TSSOP

Package Shape

RECTANGULAR

Manufacturer

Philips Semiconductors

Part Life Cycle Code

Transferred

Ihs Manufacturer

飞利浦半导体

Risk Rank

5.68

Prop.

10 ns

JESD-609代码

e3

端子表面处理

Matte Tin (Sn)

子类别

Gates

技术

CMOS

端子位置

DUAL

终端形式

鸥翼

端子间距

0.635 mm

JESD-30代码

R-PDSO-G5

资历状况

不合格

电源

5 V

温度等级

AUTOMOTIVE

逻辑IC类型

INVERTER

最大 I(ol)

0.008 A

施密特触发器

NO

达到SVHC

unknown